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...tor circuit]]s. Point-to-point construction is still widespread in [[power electronics]], where components are bulky and serviceability is a consideration, and to ...constructed first, from [[sheet metal]] or [[wood]]. Insulated [[terminal (electronics)|terminal]] strips were then [[rivet]]ed, [[nail (engineering)|nail]]ed or ...

{{about-distinguish|the electronics technique|Wire wrapped jewelry}} ...ounted "A" and "B" drive carriages, a {{convert|6|ft|adj=on|abbr=on}} tall electronics cabinet loaded with hundreds of IBM control relays, many dozens of solenoid ...

...Organic compound|organic]] molecules or [[polymer]]s that show desirable [[Electronics|electronic]] properties such as [[Electrical resistivity and conductivity|c ...i, Franco Cacialli ''Functional Supramolecular Architectures: for Organic Electronics and Nanotechnology'' 2010 Wiley {{ISBN|978-3-527-32611-2}}</ref> The polyme ...

{{Distinguish|Printed electronics}} ...the [[Via (electronics)|through-hole paths]] to the other surface, [[Via (electronics)|vias]] connecting traces on both sides, and some electronic components mou ...

{{About|electronics}} ...971, retrieved 14 Jan 2017.</ref><ref>[https://www.vectorelect.com/ Vector Electronics and Technology; Company Website.]</ref> ...

...C''', is a term used since at least 1961<ref>''Proceedings of the National Electronics Conference, Volume 17'', National Engineering Conference, Inc., 1961; page ...s for a very rugged and high-resolution display fabricated even on silicon substrates. AMEL displays of 1280×1024 at over 1000 lines per inch (LPI) have been dem ...

{{see also|printed electronics|roll-to-roll|textile printing}} ...web.archive.org/web/20150707053928/http://www.fespa.com/news/blogs/printed-electronics-a-new-world-of-opportunity.html |archive-date=2015-07-07 }}</ref> including ...

{{Short description|Light-sensitive material used in making electronics}} ...to form a patterned coating on a surface. This process is crucial in the [[electronics industry]].<ref>{{cite book |last1=Eric |first1=Anslyn |title=Modern physic ...

...]. It was involved in aircraft, the space industry, defense and commercial electronics, components in the [[automotive industry]], printing presses, [[avionics]] ...nto nine major divisions: Space, Aircraft, Defense Electronics, Commercial Electronics, Light Duty Automotive Components, Heavy Duty Automotive Components, Printi ...

...kipedia | title=New products, new energy in the storage industry | journal=Electronics | publisher=Endeavor Business Media | page=65 ''et seq'' | volume=64 | numb ...

...ress Inc., p. 1203. {{ISBN|0-8311-1200-X}}</ref> and is commonly used in [[electronics]], [[plumbing]], and sheet metal work. [[Alloy]]s that melt between {{conve ...lectronic components. They are almost exclusively used today in [[consumer electronics]].<ref name="Ogunseitan-2007">{{cite journal | last1 = Ogunseitan | first1 ...

In typical CVD, the [[wafer (electronics)|wafer]] (substrate) is exposed to one or more [[Volatility (chemistry)|vol .... R. |title=Reverse graded SiGe/Ge/Si buffers for high-composition virtual substrates |journal=Journal of Applied Physics |date=15 March 2010 |volume=107 |issue= ...

...chnology is distinguished from [[molecular nanotechnology]] or [[molecular electronics]] in that the latter two must also consider [[surface chemistry]]. ...[[semiconductor device fabrication]] technologies, normally used to make [[electronics]].<ref>{{Cite journal|vauthors=Angell JB, Terry SC, Barth PW|date=1983|titl ...

| Consumer electronics | Manufactures substrates used in the manufacturing of semiconductors ...

In [[electronics]], a '''wafer''' (also called a '''slice''' or '''substrate''')<ref> ''How to Make a Chip.'' Adapted from Design News. Reed Electronics Group.</ref> ...

...other electronic devices. Historically, the first decade of semiconductor electronics was based entirely on germanium. Presently, the major end uses are [[fibre- ...g [[World War II]], small amounts of germanium were used in some special [[electronics|electronic devices]], mostly [[diode]]s.<ref>{{cite news |author=W. K. |url ...

...paring silicon on insulator (SOI) substrates from conventional [[silicon]] substrates is the ''SIMOX'' (separation by implantation of oxygen) process, wherein a ...crystallographic structure to the target, and especially in semiconductor substrates where the crystal structure is more open, particular crystallographic direc ...

* Does not stick to many substrates, but adheres very well to others, e.g. glass ...ollowing major categories of application: Electrical (such as insulation), electronics (such as coatings), household (such as sealants and cooking utensils), auto ...

...e junctions is the basis of [[diode]]s, [[transistor]]s, and most modern [[electronics]]. Some examples of semiconductors are [[silicon]], [[germanium]], [[galliu ...tle=Electrons and holes in semiconductors: with applications to transistor electronics |date=1950 |publisher=R. E. Krieger Pub. Co |isbn=978-0-88275-382-9}}{{pn|d ...

...ectricity. Flexible electronic paper uses plastic substrates and [[plastic electronics]] for the display backplane. Applications of e-paper include [[electronic s ...transistors | title=2016 IEEE International Conference on Recent Trends in Electronics, Information & Communication Technology (RTEICT) | chapter-url=https://ieee ...